Njengoba ubhubhane lwe-COVID-19 luqhubeka futhi isidingo sama-chip siqhubeka nokwenyuka emikhakheni esukela emishinini yezokuxhumana kuya kugesi wabathengi kuya ezimotweni, ukushoda komhlaba wonke kwama-chips kuyakhula.
I-Chip iyingxenye ebalulekile eyisisekelo yemboni yezobuchwepheshe bolwazi, kodwa futhi imboni ebalulekile ethinta yonke inkambu yobuchwepheshe obuphezulu.
Ukwenza i-chip eyodwa kuyinqubo eyinkimbinkimbi ebandakanya izinkulungwane zezinyathelo, futhi isigaba ngasinye senqubo sigcwele ubunzima, okuhlanganisa izinga lokushisa elidlulele, ukuchayeka kumakhemikhali ahlasela kakhulu, kanye nezidingo zokuhlanzeka ngokweqile. Ipulasitiki idlala indima ebalulekile enqubweni yokukhiqiza ye-semiconductor, amapulasitiki e-antistatic, i-PP, i-ABS, i-PC, i-PPS, izinto ze-fluorine, i-PEEK namanye ama-plastiki asetshenziswa kabanzi kwinqubo yokukhiqiza ye-semiconductor. Namuhla sizobheka ezinye zezinhlelo zokusebenza i-PEEK enazo kuma-semiconductors.
I-Chemical mechanical grinding (CMP) yisigaba esibalulekile senqubo yokukhiqiza i-semiconductor, esidinga ukulawulwa okuqinile kwenqubo, ukulawulwa okuqinile kokuma kwendawo kanye nekhwalithi ephezulu. Ithrendi yentuthuko ye-miniaturization iphinde ibeke phambili izidingo eziphakeme zokusebenza kwenqubo, ngakho-ke izidingo zokusebenza zendandatho egxilile ye-CMP ziya ngokuya ziba phezulu.
Indandatho ye-CMP isetshenziselwa ukubamba i-wafer endaweni ngesikhathi sokugaya. Izinto ezikhethiwe kufanele zigweme ukuklwebheka nokungcola endaweni eyilucwecwana. Ngokuvamile kwenziwa nge-PPS evamile.
I-PEEK ifaka ukuqina kobukhulu obuphakeme, ukucutshungulwa kalula, izakhiwo ezinhle zemishini, ukumelana namakhemikhali, nokumelana okuhle nokugqokwa. Uma kuqhathaniswa nendandatho ye-PPS, I-CMP egxilile indandatho eyenziwe nge-PEEK inokumelana nokugqokwa okukhulu nempilo yesevisi ekabili, ngaleyo ndlela yehlise isikhathi sokuphumula futhi ithuthukise ukukhiqizwa kwe-wafer.
Ukukhiqizwa kwe-wafer kuyinqubo eyinkimbinkimbi futhi enzima edinga ukusetshenziswa kwezimoto ukuze zivikele, zithuthe, futhi zigcine amawafa, njengamabhokisi okudlulisa amawafa avulekile ngaphambili (ama-FOUP) kanye nobhasikidi abangama-wafer. Abathwali be-semiconductor bahlukaniswe ngezinqubo zokudlulisa ezijwayelekile kanye nezinqubo ze-asidi nesisekelo. Ukushintsha kwezinga lokushisa ngesikhathi sezinqubo zokushisisa nokupholisa kanye nezinqubo zokwelashwa ngamakhemikhali kungabangela izinguquko kusayizi wabathwali be-wafer, okuholela ekuklwebeni kwe-chip noma ukuqhekeka.
I-PEEK ingasetshenziswa ukwenza izimoto zezinqubo zokudlulisa okuvamile. I-anti-static PEEK (PEEK ESD) isetshenziswa kakhulu. I-PEEK ESD inezinto eziningi ezinhle kakhulu, ezihlanganisa ukumelana nokugqokwa, ukumelana namakhemikhali, ukuzinza kwe-dimensional, impahla ye-antistatic kanye ne-degas ephansi, okusiza ukuvimbela ukungcoliswa kwezinhlayiyana nokuthuthukisa ukuthembeka kokuphathwa kwe-wafer, ukugcinwa nokudluliswa. Thuthukisa ukuqina kokusebenza kwebhokisi elingaphambili elivulekile lokudlulisa i-wafer (FOUP) nobhasikidi wezimbali.
Ibhokisi lemaski eliphelele
Inqubo ye-lithography esetshenziselwa imaskhi yesithombe kufanele igcinwe ihlanzekile, inamathele ekumbozweni okukhanyayo noma yiluphi uthuli noma imihuzuko ekucekeleni phansi kwekhwalithi ye-projection, ngakho-ke, imaski, noma ngabe isekwenziweni, ekucubungulweni, ekuthuthweni, ekuthuthweni, ekugcinweni kwayo, zonke zidinga ukugwema ukungcoliswa kwemaski kanye umthelela wezinhlayiyana ngenxa yokushayisana kanye nokuhlanzeka kwemaski yokungqubuzana. Njengoba imboni ye-semiconductor iqala ukwethula ubuchwepheshe bokuthungatha ukukhanya kwe-ultraviolet (EUV) ngokwedlulele, isidingo sokugcina imaski ye-EUV engenasici iphezulu kunangaphambili.
Ukukhishwa kwe-PEEK ESD ngobulukhuni obukhulu, izinhlayiya ezincane, ukuhlanzeka okuphezulu, i-antistatic, ukumelana nokugqwala kwamakhemikhali, ukumelana nokugqoka, ukumelana ne-hydrolysis, amandla amahle kakhulu we-dielectric kanye nokumelana okuhle kakhulu nezici zokusebenza kwemisebe, ngesikhathi sokukhiqiza, ukudlulisela kanye nokucubungula imaski, kungenza ishidi lemaski eligcinwe ekungcolisweni okuphansi kwe-ionic kanye nokungcoliswa kwe-ionic okuphansi kwemvelo.
Ukuhlolwa kwe-chip
I-PEEK ifaka ukumelana nokushisa okuphezulu okuhle kakhulu, ukuqina kohlangothi, ukukhishwa kwegesi ephansi, ukuchithwa kwezinhlayiyana eziphansi, ukumelana nokugqwala kwamakhemikhali, nomshini olula, futhi ingasetshenziselwa ukuhlola ama-chip, okuhlanganisa amapuleti e-matrix okushisa aphezulu, izindawo zokuhlola, amabhodi esekethe aguquguqukayo, amathangi okuhlola , nezixhumi.
Ngaphezu kwalokho, ngokwanda kokuqwashisa ngemvelo ukongiwa kwamandla, ukunciphisa ukungcola kanye nokunciphisa ukungcoliswa kwepulasitiki, imboni ye-semiconductor ikhuthaza ukukhiqizwa okuluhlaza, ikakhulukazi isidingo semakethe yama-chip siqinile, futhi ukukhiqizwa kwama-chip kudinga amabhokisi we-wafer nezinye izinto ezidingekayo, imvelo umthelela awukwazi ukubukelwa phansi.
Ngakho-ke, imboni ye-semiconductor ihlanza futhi isebenzise kabusha amabhokisi angama-wafer ukunciphisa ukumoshwa kwezinsiza.
I-PEEK inokulahlekelwa okuncane kokusebenza ngemva kokushisisa okuphindaphindiwe futhi ingaphinda isetshenziswe ngo-100%.
Isikhathi sokuthumela: 19-10-21